Topic 1. Nanomaterials and Nanostructures
Session Chairs:
- Dr. Chen Zhong, Nanyang Technological University (Singapore)
- Dr. Wei Jun, SIMTech (Singapore)
Session Committee Members:
- Zuruzi Abu Samah, Nanyang Polytechnic (Singapore)
- Chi Dong Zhi, IMRE (Singapore)
- Dai Ji Yan, Hong Kong PolyU (Hong Kong)
- David A. Hutt, Loughborough University (UK)
- Aditya Kumar, IME (Singapore)
- Ng Chee Mang, Chartered Semiconductor (Singapore)
- Young-Bae Park, Andong University (Korea)
- Gunnar Westin, Uppsala University (Sweden)
The semiconductor industry is moving into the 32-nm node, with minimum on-chip wire dimensions of 50 nm or less. Revolutionary materials and technologies are needed in order to meet the increasing challenges brought by the ever shrinking transistor and its derived integrated circuits and devices. For example, the current prevailing on-chip interconnect materials and processes may run to their limits soon since electron transport dissipation becomes prohibitively intense at small feature sizes. The use of ultra low-k materials causes reliability problems in the subsequent packing process. This session aims to provide a forum for researchers around the world to discuss both existing and emerging solutions to the problems faced by the nanoelectronics industries through the use of novel nano-engineered and molecular materials. Challenges in their processing and integration with existing designs and processes will also be addressed.
Topics include, but are not limited to:
- Advanced interconnect materials (CVD, PVD, ALD, electrolytic and electroless deposition; liner and Cu seed; lead-free solder)
- Materials for alternative interconnect technologies (e.g. optical interconnect; plasmonics and plasmonic networks; 3D stacking; through-via technology and Si interposer; adhesive joining)
- Interconnect reliability (e.g. electromigration; stress migration; thermomigration; ionic migration; dielectric breakdown)
- Low-k dielectrics (e.g. spin-on and CVD low-k materials; UV, e-beam, and plasma curing of low-k materials; porosity characterization and management; novel low-k materials)
- Development of ultra-thin barrier materials
- Self assembly of nanomaterials and nanostructures
- Synthesis and applications of nano-wires and tubes
